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Rapid 3D Assembly of Liquid Metal Electronics
THE CHALLENGE
A major challenge in advancing flexible and stretchable electronics is the lack of a fast, reliable, and scalable way to create electrical interconnections (vias) between circuit layers. Current methods rely on slow multi-step techniques that drill physical openings and fill them with conductive materials. These processes are difficult...
Published: 3/26/2026
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Updated: 3/26/2026
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Inventor(s): Michael Bartlett, Dong Hae Ho
Keywords(s):
Category(s): Technology Classifications > Electronics
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Liquid metal-vitrimer composites
THE CHALLENGE
The electronics industry faces a significant challenge in developing materials that balance high electrical performance, mechanical durability, and environmental sustainability. Most current solutions rely on thermosetting plastics that are extremely difficult to recycle, contributing to a growing e-waste problem. Efforts to enhance...
Published: 2/12/2026
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Updated: 7/21/2025
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Inventor(s): Michael Bartlett, Josh Worch, Dong Hae Ho, Meng Jiang
Keywords(s):
Category(s): Technology Classifications > Electronics
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Thin Film to Improve Lithium Batteries
THE CHALLENGE
Lithium ion batteries are extremely popular in modern electronics due to their high energy and power density as well as a lack of memory effect. Unfortunately, Li ion batteries are hampered with problems involving internal short circuits due to lithium dendrite growth. Current coating technologies used to impede dendrite formation have...
Published: 10/20/2025
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Updated: 11/7/2023
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Inventor(s): Guoliang Liu, Dong Guo
Keywords(s):
Category(s): Technology Classifications > Chemicals/Materials, Technology Classifications > Energy
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