Search Results - guo-quan+lu

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Double-side Cooled Medium-Voltage Power Modules for Electric Grid Applications
THE CHALLENGE Packaging innovations are needed for medium-voltage semiconductor devices to enable their integration into electric grid applications due to a unique trade-off between the insulation requirement and thermal management of the medium-voltage power modules. The conventional packaging technology utilizes a wire-bonded or press-pack module...
Published: 6/7/2022   |   Inventor(s): Guo-Quan Lu, Zichen Zhang
Category(s): Electrical
Double-Side Cooled Power Modules with Sintered-Silver Interposer
THE CHALLENGE Advances of wide bandgap devices, e.g. SiC and GaN, enable power electronics converters with higher efficiency and higher power-density, but pose significant challenges on power module packaging. Planar, double-side cooled power modules are emerging in electric-drive inverters because of their low profile, better heat extraction, and...
Published: 6/6/2022   |   Inventor(s): Guo-Quan Lu, Chao Ding
Category(s): Electrical
Additive Manufacturing of Magnetic Components
A paste based additive process is used to produce complex, multi-material, capacitive, magnetic, and resistive components. The method allows for concurrent manufacturing of components from stable magnetic and metallic pastes at low temperatures. By forming inductors and transformers with complex structures, the flux density distribution may be...
Published: 9/21/2015   |   Inventor(s): Guo-Quan Lu, William Monzel, Yi Yan
Category(s): Electrical, Optics