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High-Frequency Integrated Point-of-Load (POL) Module with PCB Embedded Inductor Substrate
This innovation presents the high frequency integrated Point-of-Load (POL) module with PCB embedded inductor substrate. First, the high density and low profile inductor structure is proposed so that the magnetic core can become a thin enough layer to be sandwiched into multi-layer PCB. Then the magnetic layer is embedded into PCB just following conventional...
Published: 7/15/2013   |   Inventor(s): Yipeng Su, Qiang Li, Fred Lee, Wenli Zhang
Category(s): Electrical, Energy