Search Results - yipeng+su

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Low Profile Coupled Inductor Substrate with Transient Speed Improvement
This innovation presents the low profile inverse coupled inductor with very fast transient response for the high density 3D integrated VR module to power the microprocessor. The inhomogenous core structure is proposed by introducing a non-magnetic material or low permeability magnetic material into the leakage flux path of the coupled inductor. The...
Published: 8/12/2014   |   Inventor(s): Yipeng Su, Dongbin Hou, Fred Lee, Qiang Li
Keywords(s):  
Category(s): Electrical, Energy, Engineering
High-Frequency Integrated Point-of-Load (POL) Module with PCB Embedded Inductor Substrate
This innovation presents the high frequency integrated Point-of-Load (POL) module with PCB embedded inductor substrate. First, the high density and low profile inductor structure is proposed so that the magnetic core can become a thin enough layer to be sandwiched into multi-layer PCB. Then the magnetic layer is embedded into PCB just following conventional...
Published: 7/15/2013   |   Inventor(s): Yipeng Su, Qiang Li, Fred Lee, Wenli Zhang
Keywords(s):  
Category(s): Electrical, Energy