High-Frequency Integrated Point-of-Load (POL) Module with PCB Embedded Inductor Substrate

This innovation presents the high frequency integrated Point-of-Load (POL) module with PCB embedded inductor substrate. First, the high density and low profile inductor structure is proposed so that the magnetic core can become a thin enough layer to be sandwiched into multi-layer PCB. Then the magnetic layer is embedded into PCB just following conventional industrial process. The four-layer PCB and DrMos power devices are used to build the integrated POL module which is very simple and cost effective. The standardized manufacturing process further reduces the cost and enables the mass production of such kinds of PCB integrated POL modules.
Patent Information:
For Information, Contact:
Li Chen
Licensing Associate
Virginia Tech Intellectual Properties, Inc.
(540) 443-9217
Yipeng Su
Qiang Li
Fred Lee
Wenli Zhang