Low Profile Coupled Inductor Substrate with Transient Speed Improvement

Description:
This innovation presents the low profile inverse coupled inductor with very fast transient response for the high density 3D integrated VR module to power the microprocessor. The inhomogenous core structure is proposed by introducing a non-magnetic material or low permeability magnetic material into the leakage flux path of the coupled inductor. The transient speed of the coupled inductor can be well controlled by finely tuning the leakage flux. The coupled inductors with different transient performance can be designed and fabricated according to the transient requirement of the system.
Patent Information:
For Information, Contact:
Li Chen
Licensing Associate
Virginia Tech Intellectual Properties, Inc.
(540) 443-9217
lchen@vtip.org
Inventors:
Yipeng Su
Dongbin Hou
Fred Lee
Qiang Li
Keywords:
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