THE CHALLENGE
A major challenge in advancing flexible and stretchable electronics is the lack of a fast, reliable, and scalable way to create electrical interconnections (vias) between circuit layers. Current methods rely on slow multi-step techniques that drill physical openings and fill them with conductive materials. These processes are difficult to automate and expensive to scale, which limits mass production and slows time to market. At the same time, the rigid materials used in conventional vias do not match the softness of flexible substrates, leading to stress points that reduce product durability and increase failure rates. As devices like wearables and soft robots become more complex, companies need an interconnect solution that is both mechanically robust and easy to manufacture.
OUR SOLUTION
We offer a novel process called Liquid Metal Sedimentation for Three Dimensional Assembly of Electrical Interconnects (LM STAIR) which offers manufacturers a faster, simpler, and scalable way to build flexible multilayer electronic circuits. Instead of drilling and filling, our method uses liquid metal microdroplets in a photocurable polymer that naturally settle into place to form reliable conductive paths. This gravity guided self-assembly approach removes major production bottlenecks, reduces mechanical weak points, and allows hundreds of interconnects to form in seconds.
Figure: Photograph of electrodes including 200 junctions and diagram of LM microdroplets in the polymer matrix.
Advantages:
- Rapid and scalable formation of multilayer interconnects without through hole vias
- High mechanical compliance and durability under strain and bending
- Low resistance and stable electrical performance
- Reduced production complexity and cost
Potential Application:
- Wearable and flexible health monitoring devices
- Soft robotics and deformable sensor systems
- Flexible and foldable display manufacturing
- Advanced medical implants and body worn electronics
