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Rapid 3D Assembly of Liquid Metal Electronics

THE CHALLENGE A major challenge in advancing flexible and stretchable electronics is the lack of a fast, reliable, and scalable way to create electrical interconnections (vias) between circuit layers. Current methods rely on slow multi-step techniques that drill physical openings and fill them with conductive materials. These processes are difficult...

Published: 3/26/2026 | Updated: 3/26/2026 | Inventor(s): Michael Bartlett, Dong Hae Ho

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Category(s): Technology Classifications > Electronics

Liquid metal-vitrimer composites

THE CHALLENGE The electronics industry faces a significant challenge in developing materials that balance high electrical performance, mechanical durability, and environmental sustainability. Most current solutions rely on thermosetting plastics that are extremely difficult to recycle, contributing to a growing e-waste problem. Efforts to enhance...

Published: 2/12/2026 | Updated: 7/21/2025 | Inventor(s): Michael Bartlett, Josh Worch, Dong Hae Ho, Meng Jiang

Keywords(s):

Category(s): Technology Classifications > Electronics